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Low Temperature Bonding Technology in Ambient Air for 3D Hetero Integration of Mixed Substrates
(異種信号3次元混載のための低温大気圧接合技術)
3rd Empa-WUT-NIMS Workshop. September 08, 2010-September 10, 2010. Invited
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2022-09-05 12:52:39 +0900 Updated at: 2024-03-05 11:43:06 +0900