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The analysis of joining boundary between Ni-P electroless plate and lead-free Solder by wavelength-dispersive EPMA equipped with a FE electron gun.
17th International Vacuum Congress. July 01, 2007-July 06, 2007.
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2017-02-14 11:05:01 +0900Updated at: 2017-07-10 19:56:32 +0900