3次元SiPのためのバンプレスインタコネクト
(Bumpless Interconnect for High Density 3D SiP)
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2020-11-20 10:37:23 +0900Updated at: 2020-11-20 10:37:23 +0900