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Bonding mechanisms of thermally softened metallic powder particles and substrates impacted at high velocity

KeeHyun Kim, Makoto Watanabe, Seiji Kuroda.
Surface and Coatings Technology 204 [14] 2175-2180. 2010.

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      作成時刻 :2016-05-24 16:01:49 +0900 更新時刻 :2020-11-16 22:54:14 +0900

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