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Bonding mechanisms of thermally softened metallic powder particles and substrates impacted at high velocity

KeeHyun Kim, Makoto Watanabe, Seiji Kuroda.
Surface and Coatings Technology 204 [14] 2175-2180. 2010.

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      Created at: 2016-05-24 16:01:49 +0900Updated at: 2024-09-12 07:49:19 +0900

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