HOME > Article > DetailHolographic interferometric microscopy for measuring Cu2+ concentration profile during Cu electrodeposition in a magnetic field(磁場中の銅電析に伴う銅イオン濃度分布の干渉計測定)Kei Nishikawa, Takaki Saito, Hisayoshi Matsushima, Mikito Ueda. Electrochimica Acta 297 1104-1108. 2019.https://doi.org/10.1016/j.electacta.2018.12.025 NIMS author(s)NISHIKAWA, KeiFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2019-03-01 12:16:07 +0900 Updated at: 2026-11-08 05:05:39 +0900