Holographic interferometric microscopy for measuring Cu2+ concentration profile during Cu electrodeposition in a magnetic field | 研究者総覧SAMURAI - 物質・材料研究機構 (NIMS)

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Holographic interferometric microscopy for measuring Cu2+ concentration profile during Cu electrodeposition in a magnetic field
(磁場中の銅電析に伴う銅イオン濃度分布の干渉計測定)

Kei Nishikawa, Takaki Saito, Hisayoshi Matsushima, Mikito Ueda.

Electrochimica Acta 297 1104-1108. 2019.

https://doi.org/10.1016/j.electacta.2018.12.025

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西川慶

Materials Data Repository (MDR)上の本文・データセット

作成時刻: 2019-03-01 12:16:07 +0900更新時刻: 2024-04-02 01:49:31 +0900

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