Thermal Conductivity and Thermal Boundary Resistance of Low–Dielectric Constant Interlayer Dielectrics in Advanced Very Large Scale Integration Interconnects

Tianzhuo Zhan; Chong Zheng; Mao Xu; Zhi Cao; Yen-Ju Wu; Yibin Xu; Ryo Yokogawa; Atsushi Ogura; Yanming Xue; Haidong Wang; Mengjie Song; Wei Wang; Bo Chen; Takanobu Watanabe; Yonggang Jiang; Huawei Chen; Deyuan Zhang; Tianzhuo Zhan; Chong Zheng; Mao Xu; Zhi Cao; Yen-Ju Wu; Yibin Xu; Ryo Yokogawa; Atsushi Ogura; Yanming Xue; Haidong Wang; Mengjie Song; Wei Wang; Bo Chen; Takanobu Watanabe; Yonggang Jiang; Huawei Chen; Deyuan Zhang

doi:10.1021/acsaelm.5c01142

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Thermal Conductivity and Thermal Boundary Resistance of Low–Dielectric Constant Interlayer Dielectrics in Advanced Very Large Scale Integration Interconnects

Tianzhuo Zhan, Chong Zheng, Mao Xu, Zhi Cao, Yen-Ju Wu, Yibin Xu, Ryo Yokogawa, Atsushi Ogura, Yanming Xue, Haidong Wang, Mengjie Song, Wei Wang, Bo Chen, Takanobu Watanabe, Yonggang Jiang, Huawei Chen, Deyuan Zhang.

ACS Applied Electronic Materials 7 [18] 8428-8439. 2025.

https://doi.org/10.1021/acsaelm.5c01142

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MDRavailable Thermal Conductivity and Thermal Boundary Resistance of Low–Dielectric Constant Interlayer Dielectrics in Advanced Very Large Scale Integration Interconnects

作成時刻: 2025-12-10 03:10:34 +0900 更新時刻: 2026-09-19 04:38:54 +0900