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Development of a high-strength high-conductivity Cu-Ni-P alloy. Part 2: processing by severe deformation

A. Belyakov, M. Murayama, Y. Sakai, K. Tsuzaki, M. Okubo, M. Eto, T. Kimura.
Journal of Electronic Materials 35 [11] 2000-2008. 2006.

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