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TEM Study of Local Conduction Mechanisms in Model Specimens of Ag-Based Conductive Adhesive
(導電性Agペーストのモデル試料における局所導電性メカニズムのTEM解析)

Keita Kurosu, Naoyuki Kawamoto, Yasukazu Murakami, Daisuke Shindo.
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 [2] 294-299. 2012.
https://doi.org/10.1109/tcpmt.2011.2176734

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