HOME > 論文 > 書誌詳細Three-Dimensional Analysis of the Interface between an Sn-8wt%Zn-3wt%Bi Solder and a Substrate by Using an Angle-Lapping Method(斜め研磨法を利用した錫-亜鉛-ビスマス系鉛フリーハンダと基板間の3次元構造解析)Nobuhiro Ishikawa, Takashi Kimura, Kenji Nishida, Takeshi Aoyagi, Kazuo Furuya, Takashi Sugizaki. Journal of Electronic Materials 35 [7] 1537-1542. 2006.https://doi.org/10.1007/s11664-006-0145-6 NIMS著者石川 信博木村 隆Materials Data Repository (MDR)上の本文・データセット作成時刻 :2016-05-24 15:02:27 +0900 更新時刻 :2020-11-16 23:11:53 +0900