Three-Dimensional Analysis of the Interface between an Sn-8wt%Zn-3wt%Bi Solder and a Substrate by Using an Angle-Lapping Method | 研究者総覧SAMURAI - 物質・材料研究機構 (NIMS)

HOME > 論文 > 書誌詳細

Three-Dimensional Analysis of the Interface between an Sn-8wt%Zn-3wt%Bi Solder and a Substrate by Using an Angle-Lapping Method
(斜め研磨法を利用した錫－亜鉛－ビスマス系鉛フリーハンダと基板間の3次元構造解析)

Nobuhiro Ishikawa, Takashi Kimura, Kenji Nishida, Takeshi Aoyagi, Kazuo Furuya, Takashi Sugizaki.

Journal of Electronic Materials 35 [7] 1537-1542. 2006.

https://doi.org/10.1007/s11664-006-0145-6

NIMS著者

石川信博

Materials Data Repository (MDR)上の本文・データセット

作成時刻: 2016-05-24 15:02:27 +0900 更新時刻: 2026-08-30 04:21:31 +0900

▲ページトップへ移動