Influence of Carrier Density and Energy Barrier Scattering on a High Seebeck Coefficient and Power Factor in Transparent Thermoelectric Copper Iodide | 研究者総覧SAMURAI - 物質・材料研究機構 (NIMS)

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Influence of Carrier Density and Energy Barrier Scattering on a High Seebeck Coefficient and Power Factor in Transparent Thermoelectric Copper Iodide

Peter P. Murmu, Varun Karthik, Zihang Liu, Vedran Jovic, Takao Mori, Wanli L. Yang, Kevin E. Smith, John V. Kennedy.

ACS Applied Energy Materials 3 [10] 10037-10044. 2020.

https://doi.org/10.1021/acsaem.0c01724

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森孝雄

Materials Data Repository (MDR)上の本文・データセット

作成時刻: 2020-10-29 03:00:17 +0900更新時刻: 2024-04-02 01:12:00 +0900

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