HOME > Article > DetailInfluence of Carrier Density and Energy Barrier Scattering on a High Seebeck Coefficient and Power Factor in Transparent Thermoelectric Copper IodidePeter P. Murmu, Varun Karthik, Zihang Liu, Vedran Jovic, Takao Mori, Wanli L. Yang, Kevin E. Smith, John V. Kennedy. ACS Applied Energy Materials 3 [10] 10037-10044. 2020.https://doi.org/10.1021/acsaem.0c01724 NIMS author(s)MORI, TakaoFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2020-10-29 03:00:17 +0900Updated at: 2024-04-02 01:12:00 +0900