HOME > Article > DetailA comparative study of interfacial thermal conductance between metal and semiconductorKongping Wu, Leng Zhang, Danbei Wang, Fangzhen Li, Pengzhan Zhang, Liwen Sang, Meiyong Liao, Kun Tang, Jiandong Ye, Shulin Gu. Scientific Reports 12 [1] 19907. 2022.https://doi.org/10.1038/s41598-022-24379-z Open Access Springer Science and Business Media LLC (Publisher) NIMS author(s)SANG, LiwenLIAO, MeiyongFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2022-11-23 03:25:15 +0900Updated at: 2024-05-01 08:34:23 +0900
