HOME > Article > DetailIn situ investigation of unidirectional solidification in Sn–0.7Cu and Sn–0.7Cu–0.06NiC.M. Gourlay, K. Nogita, A.K. Dahle, Y. Yamamoto, K. Uesugi, T. Nagira, M. Yoshiya, H. Yasuda. Acta Materialia 59 [10] 4043-4054. 2011.https://doi.org/10.1016/j.actamat.2011.03.028 NIMS author(s)NAGIRA, TomoyaFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2020-12-03 23:50:55 +0900Updated at: 2024-04-02 02:02:55 +0900
