HOME > 論文 > 書誌詳細The role of sulfur valency on thermoelectric properties of sulfur ion implanted copper iodidePeter P. Murmu, John Kennedy, Zihang Liu, Takao Mori. Journal of Alloys and Compounds 921 166103. 2022.https://doi.org/10.1016/j.jallcom.2022.166103 Open Access Elsevier BV (Publisher) NIMS著者森 孝雄Materials Data Repository (MDR)上の本文・データセット作成時刻: 2022-10-22 03:13:26 +0900更新時刻: 2024-03-31 16:44:04 +0900
