HOME > Article > DetailThe role of sulfur valency on thermoelectric properties of sulfur ion implanted copper iodidePeter P. Murmu, John Kennedy, Zihang Liu, Takao Mori. Journal of Alloys and Compounds 921 166103. 2022.https://doi.org/10.1016/j.jallcom.2022.166103 NIMS author(s)MORI, TakaoFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2022-10-22 03:13:26 +0900 Updated at: 2026-09-29 08:16:12 +0900
