Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer | SAMURAI, NIMS Researchers Directory Service

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Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer

Xiaoli Wang, Chau-Chang Chou, Liberty Tse-Shu Wu, Rudder Wu, Jyh-Wei Lee, Horng-Yi Chang.

Materials 14 [10] 2571. 2021.

https://doi.org/10.3390/ma14102571

Open Access MDPI AG (Publisher)

NIMS author(s)

WU, Rudder

Fulltext and dataset(s) on Materials Data Repository (MDR)

Created at: 2021-11-27 03:36:28 +0900 Updated at: 2026-10-30 07:25:40 +0900

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