HOME > 論文 > 書誌詳細Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu InterlayerXiaoli Wang, Chau-Chang Chou, Liberty Tse-Shu Wu, Rudder Wu, Jyh-Wei Lee, Horng-Yi Chang. Materials 14 [10] 2571. 2021.https://doi.org/10.3390/ma14102571 Open Access MDPI AG (Publisher) NIMS著者ウー ラダーMaterials Data Repository (MDR)上の本文・データセット作成時刻: 2021-11-27 03:36:28 +0900更新時刻: 2024-03-31 14:36:26 +0900
