Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface | SAMURAI, NIMS Researchers Directory Service

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Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface

Kongping Wu, Leng Zhang, Fangzhen Li, Liwen Sang, Meiyong Liao, Kun Tang, Jiandong Ye, Shulin Gu.

Carbon 223 119021. 2024.

https://doi.org/10.1016/j.carbon.2024.119021

Open Access

NIMS author(s)

LIAO, Meiyong

Fulltext and dataset(s) on Materials Data Repository (MDR)

Created at: 2024-03-28 09:53:18 +0900 Updated at: 2026-10-30 09:59:37 +0900

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