HOME > 論文 > 書誌詳細Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interfaceKongping Wu, Leng Zhang, Fangzhen Li, Liwen Sang, Meiyong Liao, Kun Tang, Jiandong Ye, Shulin Gu. Carbon 223 119021. 2024.https://doi.org/10.1016/j.carbon.2024.119021 NIMS著者サン リウエン廖 梅勇Materials Data Repository (MDR)上の本文・データセット作成時刻: 2024-03-28 09:53:18 +0900更新時刻: 2024-03-29 10:29:44 +0900
