Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface | 研究者総覧SAMURAI - 物質・材料研究機構 (NIMS)

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Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface

Anil Kunwar, Johan Hektor, Sukeharu Nomoto, Yuri Amorim Coutinho, Nele Moelans.

International Journal of Mechanical Sciences 184 105843. 2020.

https://doi.org/10.1016/j.ijmecsci.2020.105843

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野本祐春

Materials Data Repository (MDR)上の本文・データセット

作成時刻: 2021-05-01 03:00:18 +0900更新時刻: 2024-09-05 07:36:27 +0900

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