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Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface

Anil Kunwar, Johan Hektor, Sukeharu Nomoto, Yuri Amorim Coutinho, Nele Moelans.

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Materials Data Repository (MDR)上の本文・データセット


    作成時刻: 2021-05-01 03:00:18 +0900更新時刻: 2024-05-01 07:09:15 +0900

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