Effect of material selection on bonding interface for direct wafer bonding processing of epitaxial magnetoresistive devices |

Effect of material selection on bonding interface for direct wafer bonding processing of epitaxial magnetoresistive devices

著者	チンカミン, 桜庭裕弥, 宝野和博.
会議名	The Japan Society of Applied Physics
発表年	2018
言語	Japanese