HOME > Presentation > DetailCu(Ag)/Ta2O5界面の酸化還元過程とフォーミングに対するTa2O5膜密度の影響(Redox processes at Cu(Ag)/Ta2O5 interfaces and the impact of density of a Ta2O5 film on the forming process)鶴岡 徹, Ilia Valov, 長谷川 剛, Rainer Waser, 青野 正和. 第75回応用物理学会秋季学術講演会. September 17, 2014-September 20, 2014.NIMS author(s)TSURUOKA, TohruAONO, MasakazuFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2017-01-08 04:25:40 +0900 Updated at: 2017-07-10 21:58:11 +0900