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CCDカメラを用いて測定した電子回析強度から求めたCu3Au及びB添加したNi3Alの粒界近傍における長範囲規則度
(Long-range Order Parameter NearGrain Bounding in Cu3Au and B-Doped Ni3Al Determined from Electron Diffraction Intensities Detect)
Sixth Asia-Pasific Conference on Electron Microscopy（第６回アジ. July 01, 1996-July 05, 1996.
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2017-01-08 03:59:45 +0900 Updated at: 2017-07-10 17:35:35 +0900