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Thermal strain masurement of the sdderjoints in BGA type electronic pockages using electron moire method
(電子線モアレ法によるBGAタイプ電子部品パッケージの半田ジョイントの熱応力測定)
1999 Inter National Mechanical Engineering Congress and Expositi. November 14, 1999-November 19, 1999.
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Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2017-02-18 01:49:48 +0900 Updated at: 2017-07-10 18:00:01 +0900