HOME > 口頭発表 > 書誌詳細Air-stable Cu complex inks for printed electronics with high conductivity and high reliabilityLI, Wanli, SUN, Qingqing, LIU, Xu-Ying, 菅沼 克昭, MINARI, Takeo. 2019 International Conference on Electronics Packaging. 2019.NIMS著者三成 剛生Materials Data Repository (MDR)上の本文・データセット作成時刻: 2019-08-30 03:00:19 +0900更新時刻: 2019-08-30 03:00:19 +0900