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[Introduction to new articles] Atomic Layer Deposition of Polycrystalline Tin Dioxide Thin Films Using Liquid Bis(ethylcyclopentadienyl)tin

Atomic Layer Deposition of Polycrystalline Tin Dioxide Thin Films Using Liquid Bis(ethylcyclopentadienyl)tin

Fumikazu MIZUTANI, Nobutaka TAKAHASHI, Toshihide NABATAME.
Journal of The Surface Finishing Society of Japan. . 2025. https://doi.org/10.4139/sfj.76.598

Atomic Layer Deposition of Polycrystalline Tin Dioxide Thin Films Using Liquid Bis(ethylcyclopentadienyl)tin

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The liquid compound bis(ethylcyclopentadienyl)tin, Sn(EtCp)2, was synthesized and exhibited several notable characteristics, including a vapor pressure suitable for use as a precursor and thermal stability up to 230 ℃. Using it as a precursor and O2 plasma as an oxidant, SnO2 thin films can be deposited by atomic layer deposition (ALD). A self-limiting reaction was confirmed with no nucleation delay for pulse times of 10 and 45 s for Sn(EtCp)2 and O2 plasma, respectively, at a growth temperature of 200 ℃. The growth per cycle (GPC) was 0.20 nm/ cycle, which is higher than that of conventional precursors. Cross-sectional transmission electron microscopy revealed that the SnO2 film was uniform and polycrystalline, even though it was deposited at 200 ℃. X-ray diffraction analysis revealed that the film had a tetragonal rutile SnO2 structure with a (110) preferred orientation. Sn(EtCp)2 is a promising precursor for depositing high-quality SnO2 films with a stoichiometric composition, high purity, and high crystallinity, even at low temperatures.

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