HOME > 論文 > 書誌詳細Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip InterconnectsYoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka. MATERIALS TRANSACTIONS 45 [3] 689-694. 2004.https://doi.org/10.2320/matertrans.45.689 NIMS著者木村 隆Materials Data Repository (MDR)上の本文・データセット作成時刻: 2016-05-24 12:00:42 +0900更新時刻: 2024-04-02 06:33:29 +0900
