Effect of Cu Addition Into $\hbox{TiGa}_{3}$ Compound on Superconducting Properties and Microstructure of $ \hbox{V}_{3}\hbox{Ga}$ Multifilamentary Wires Synthesized Through High Ga Content Diffusion Process
| 著者 | Y. Hishinuma, A. Kikuchi, Y. Iijima, S. Murakami, T. Kawabata, K. Matsuda, H. Taniguchi, T. Takeuchi. |
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| 掲載誌名 | IEEE Transactions on Applied Superconductivity 23 [3] 7101204-7101204 ISSN: 10518223 ESIでのカテゴリ: PHYSICS |
| 出版社 | Institute of Electrical and Electronics Engineers (IEEE) |
| 発表年 | 2013 |
| 言語 | English |
| DOI | https://doi.org/10.1109/tasc.2013.2245933 |
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