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著者名Y. Hishinuma, A. Kikuchi, Y. Iijima, S. Murakami, T. Kawabata, K. Matsuda, H. Taniguchi, T. Takeuchi.
タイトルEffect of Cu Addition Into $\hbox{TiGa}_{3}$ Compound on Superconducting Properties and Microstructure of $ \hbox{V}_{3}\hbox{Ga}$ Multifilamentary Wires Synthesized Through High Ga Content Diffusion Process
掲載誌名IEEE Transactions on Applied Superconductivity 23 [3] 7101204-7101204
ISSN: 15582515 10518223
発表年2013
言語English
ESIでのカテゴリPHYSICS
DOIhttps://doi.org/10.1109/tasc.2013.2245933
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