Impact of thermal annealing on devices based on graphene encapsulated in hexagonal boron nitride

Stephan Engels; Bernat Terrés; Felix Klein; Sven Reichardt; Matthias Goldsche; Sebastian Kuhlen; Kenji Watanabe; Takashi Taniguchi; Christoph Stampfer

doi:10.1002/pssb.201451384

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Impact of thermal annealing on graphene devices encapsulated in hexagonal boron nitride
(Impact of thermal annealing on devices based on graphene encapsulated in hexagonal boron nitride)

Stephan Engels, Bernat Terrés, Felix Klein, Sven Reichardt, Matthias Goldsche, Sebastian Kuhlen, Kenji Watanabe, Takashi Taniguchi, Christoph Stampfer.

physica status solidi (b) 251 [12] 2545-2550. 2014.

https://doi.org/10.1002/pssb.201451384

NIMS著者

Materials Data Repository (MDR)上の本文・データセット

作成時刻: 2016-05-24 17:33:38 +0900更新時刻: 2024-03-31 16:03:20 +0900

Impact of thermal annealing on graphene devices encapsulated in hexagonal boron nitride(Impact of thermal annealing on devices based on graphene encapsulated in hexagonal boron nitride)

NIMS著者

Materials Data Repository (MDR)上の本文・データセット

Impact of thermal annealing on graphene devices encapsulated in hexagonal boron nitride
(Impact of thermal annealing on devices based on graphene encapsulated in hexagonal boron nitride)