Application of constant current pulse to suppress bubble incorporation and control deposit morphology during aqueous electrophoretic deposition (EPD) | 研究者総覧SAMURAI - 物質・材料研究機構 (NIMS)

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Application of constant current pulse to suppress bubble incorporation and control deposit morphology during aqueous electrophoretic deposition (EPD)

L. Besra, T. Uchikoshi, T.S. Suzuki, Y. Sakka.

Journal of the European Ceramic Society 29 [10] 1837-1845. 2009.

https://doi.org/10.1016/j.jeurceramsoc.2008.07.031

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作成時刻: 2016-05-24 15:48:15 +0900 更新時刻: 2025-10-26 05:40:51 +0900

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