HOME > 論文 > 書誌詳細BGA Joining Property of Sn-8.8%Zn and Sn-8.0mass%Zn-3.0mass%Bi Solder on Electroless Nickel-Phosphors/Immersion Gold Plated SubsTakashi Sugizaki, Hidehiro Nakao, Takashi Kimura, Tohru Watanabe. MATERIALS TRANSACTIONS 44 [9] 1790-1796. 2003.https://doi.org/10.2320/matertrans.44.1790 NIMS著者Materials Data Repository (MDR)上の本文・データセット作成時刻: 2016-05-24 12:00:56 +0900 更新時刻: 2026-09-30 05:37:14 +0900
