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Reduction of thermal conductivity in dually doped ZnO by design of three-dimensional stacking faults

Hironao Takemoto, Keisuke Fugane, Pengfei Yan, John Drennan, Miwa Saito, Toshiyuki Mori, Hiroshi Yamamura.
RSC Adv. 4 [6] 2661-2672. 2014.
https://doi.org/10.1039/c3ra44223c

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