Thermal Deformation Analysis of Electronic Packaging Components Using Electron Moire Method
(電子線モアレ法を用いた電子部品パッケージの熱変形解析)
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2022-09-05 10:55:50 +0900 Updated at: 2022-09-05 10:55:50 +0900