HOME > 論文 > 書誌詳細Thermodynamic database on microsolders and copper-based alloy systemsX. J. Liu, I. Ohnuma, C. P. Wang, M. Jiang, R. Kainuma, K. Ishida, M. Ode, T. Koyama, H. Onodera, T. Suzuki. Journal of Electronic Materials 32 [11] 1265-1272. 2003.https://doi.org/10.1007/s11664-003-0021-6 NIMS著者小山 敏幸Materials Data Repository (MDR)上の本文・データセット作成時刻: 2016-05-24 12:01:04 +0900 更新時刻: 2026-10-01 05:23:14 +0900
