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Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles

Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone.
Thin Solid Films 529 29-33. 2013.
https://doi.org/10.1016/j.tsf.2012.03.089

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