HOME > 論文 > 書誌詳細Study on Sn-Ag Oxidation and Feasibility of Room Temperature Bonding of Sn-Ag-Cu SolderYing-Hui Wang, Matiar R Howlader, Kenji Nishida, Takashi Kimura, Tadatomo Suga. MATERIALS TRANSACTIONS 46 [11] 2431-2436. 2005.https://doi.org/10.2320/matertrans.46.2431 NIMS著者Materials Data Repository (MDR)上の本文・データセット作成時刻: 2016-05-24 14:56:56 +0900 更新時刻: 2026-09-30 05:26:06 +0900
