Effect of grain boundary scattering on carrier mobility and thermoelectric properties of tellurium incorporated copper iodide thin films | 研究者総覧SAMURAI - 物質・材料研究機構 (NIMS)

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Effect of grain boundary scattering on carrier mobility and thermoelectric properties of tellurium incorporated copper iodide thin films

Martin Markwitz, Peter P. Murmu, Song Yi Back, Takao Mori, Ben J. Ruck, John Kennedy.

Surfaces and Interfaces 41 103190. 2023.

https://doi.org/10.1016/j.surfin.2023.103190

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Materials Data Repository (MDR)上の本文・データセット

作成時刻: 2023-09-12 03:42:43 +0900 更新時刻: 2025-04-12 10:12:18 +0900

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