HOME > 論文 > 書誌詳細Effect of grain boundary scattering on carrier mobility and thermoelectric properties of tellurium incorporated copper iodide thin filmsMartin Markwitz, Peter P. Murmu, Song Yi Back, Takao Mori, Ben J. Ruck, John Kennedy. Surfaces and Interfaces 41 103190. 2023.https://doi.org/10.1016/j.surfin.2023.103190 NIMS著者バク ソンイ森 孝雄Materials Data Repository (MDR)上の本文・データセット作成時刻: 2023-09-12 03:42:43 +0900更新時刻: 2024-05-01 09:55:18 +0900
