Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects
(Sn-Ag-Cuフリップチップ接合部の熱疲労寿命に及ぼすAg濃度の影響)
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2016-05-24 11:59:47 +0900 Updated at: 2026-11-02 05:01:23 +0900