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SnZnはんだとAu/NiPフィルム接合境界の構造と接合強度におよぼすP濃度の影響
(Influence of P content in electloress plated Ni-P alloy film on intefacial structures and strength between Sn-Zn solder and plat)

Chonan Yasunori, Komiyama Takao, Onuki Jin, Urao Ryoichi, Kimura Takashi, Nagano Takahiro.
MATERIALS TRANSACTIONS 43 [8] 1887-1890. 2002.
https://doi.org/10.2320/matertrans.43.1887

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      作成時刻: 2016-05-24 11:54:12 +0900更新時刻: 2024-09-07 05:04:27 +0900

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