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Characterization of the arrangement feature of copper interconnects by Moiré inversion method
(Characterization of the arrangement feature of copper interconnects by Moir´e inversion method)

Qinghua Wang, Satoshi Kishimoto, Huimin Xie, Kewei Xu, Jianfeng Wang.
Theoretical and Applied Mechanics Letters 2 [2] 021008. 2012.
https://doi.org/10.1063/2.1202108
Open Access Elsevier BV (Publisher)

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