Material design of plasma-enhanced chemical vapour deposition SiCH films for low-<i>k</i>cap layers in the further scaling of ultra-large-scale integrated devices-Cu interconnects

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Material design of plasma-enhanced chemical vapour deposition SiCH films for low-kcap layers in the further scaling of ultra-large-scale integrated devices-Cu interconnects
(超大規模集積回路Cu配線の更なる高集積化のためのlow-kキャップ層のためのプラズマCVD-SiCH膜の材料設計)

Hideharu Shimizu, Shuji Nagano, Akira Uedono, Nobuo Tajima, Takeshi Momose, Yukihiro Shimogaki.

Open Access Informa UK Limited (Publisher)

Created at: 2016-05-24 17:28:22 +0900 Updated at: 2026-09-29 07:05:10 +0900