HOME > 論文 > 書誌詳細Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel AdditionShinichi Terashima, Yoshiharu Kariya, Masamoto Tanaka. MATERIALS TRANSACTIONS 45 [3] 673-680. 2004.https://doi.org/10.2320/matertrans.45.673 NIMS著者Materials Data Repository (MDR)上の本文・データセット作成時刻: 2016-05-24 12:03:21 +0900 更新時刻: 2026-10-01 04:39:11 +0900
