- Address
- 305-0047 1-2-1 Sengen Tsukuba Ibaraki JAPAN [Access]
[Research papers] | [Books] | [Proceedings] | [Presentations] | [Misc] | [Published patent applications]
Research papers TSV
Books TSV
Proceedings TSV
Presentations TSV
2024
- WATANABE, Ikumu, TAN, Tianwen. Potential-based formulation of ductile fracture constitutive model in finite element analysis of periodic microstructure. 14th Asia-Pacific Conference on Fracture and Strength . 2024
- TAN, Tianwen, WATANABE, Ikumu. Gradient-enhanced ductile fracture modeling with the hydrogen-induced damage acceleration. 14th Asia-Pacific Conference on Fracture and Strength . 2024
- 渡邊 育夢, タン ティアンウェン. アルミニウム合金の水素脆化マルチスケールモデリング. 軽金属学会第147回秋期大会. 2024 Invited
- WATANABE, Ikumu, TAN, Tianwen. Computational Simulation of Material behavior using Image-based Finite Element Modeling. NIMS Award Symposium 2024. 2024
2023
- TAN, Tianwen, WATANABE, Ikumu. Multiscale Modelling of Hydrogen Diffusion Induced Damage in Alloy. XVII International Conference on Computational Plasticity. 2023