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The application of micro are analysis of Al-Cu junction by wavelength-dipersive EPMA equipped with a FE electron gun.
(FE-EPMAによるAl-Cu接合境界の微細組織解析)
Microscopy and Microanalysis 2006. July 30, 2006-August 03, 2006.
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Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2017-02-14 11:06:27 +0900 Updated at: 2017-07-10 19:39:19 +0900