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Cu Ion Plating as a technique for enhancing the mechanical, electrical and thermal bonding between Cu stabilizer and RHQT-proces
(RHQT法Nb3Al線材とCu安定化材の間における機械的、電気的、熱的接続性の向上のためのCuイオンプレーティング)
Applied Superconductivity Conference 2004. October 03, 2004-October 08, 2004.
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2022-09-05 11:33:21 +0900Updated at: 2022-09-05 11:33:21 +0900