HOME > Presentation > DetailAir-stable Cu complex inks for printed electronics with high conductivity and high reliabilityLI, Wanli, SUN, Qingqing, LIU, Xu-Ying, 菅沼 克昭, MINARI, Takeo. 2019 International Conference on Electronics Packaging. 2019.NIMS author(s)MINARI, TakeoFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2019-08-30 03:00:19 +0900Updated at: 2019-08-30 03:00:19 +0900