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[Published patent application] Ｃｕ２Ｏ結晶含有層の製法、並びに、Ｃｕ２Ｏ結晶含有層を有する半導体を備える構造体及びその用途
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Created at :2025-08-16 03:11:53 +0900 Updated at :2025-08-16 03:11:53 +0900
HOME > Published patent applications > Detail
