HOME > その他の文献 > 書誌詳細Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particlesNao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Thin Solid Films 529 29-33. 2013.https://doi.org/10.1016/j.tsf.2012.03.089 NIMS著者柴田 曉伸Materials Data Repository (MDR)上の本文・データセット作成時刻: 2020-11-20 10:38:40 +0900更新時刻: 2024-04-02 02:04:07 +0900
