| 43件の論文が見つかりました。論文は出版年月日順に表示しています。（ヘルプ） | |
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| ISOBE, Masaaki, ARAI, Masao, MUROMACHI, Eiji. Thermoelectric Property of the One-Dimensional Metallic Cobalt Oxide CaCo2O4. JOURNAL OF ELECTRONIC MATERIALS. (2009) 1166-1170 | |
| Machiko Ode, Minoru Ueshima, Taichi Abe, Hideyuki Murakami, Hidehiro Onodera. Numrical prediction of fraction of eutectic phase in Sn-Ag-Cu soldering using the phase-field method. Journal of Electronic Materials. 35 [11] (2006) 1969-1974 10.1007/s11664-006-0301-z | |
| A. Belyakov, M. Murayama, Y. Sakai, K. Tsuzaki, M. Okubo, M. Eto, T. Kimura. Development of a high-strength high-conductivity Cu-Ni-P alloy. Part 2: processing by severe deformation. Journal of Electronic Materials. 35 [11] (2006) 2000-2008 10.1007/s11664-006-0306-7 | |
| M. Murayama, A. Belyakov, T. Hara, Y. Sakai, K. Tsuzaki, M. Okubo, M. Eto, T. Kimura. Development of a high-strength high-conductivity Cu-Ni-P alloy. Part 1:Characterization of precipitation products. Journal of Electronic Materials. 35 [10] (2006) 1787-1792 10.1007/s11664-006-0158-1 | |
| Nobuhiro Ishikawa, Takashi Kimura, Kenji Nishida, Takeshi Aoyagi, Kazuo Furuya, Takashi Sugizaki. Three-Dimensional Analysis of the Interface between an Sn-8wt%Zn-3wt%Bi Solder and a Substrate by Using an Angle-Lapping Method. Journal of Electronic Materials. 35 [7] (2006) 1537-1542 10.1007/s11664-006-0145-6 | |
| 苅谷義治. Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip Chip Interconnects. JOURNAL OF ELECTRONIC MATERIALS. (2004) 321-328 | |
| Machiko Ode, Toshiyuki Koyama, Hidehiro Onodera, Toshio Suzuki. Phase-field modeling for Sn-Bi soldering. Journal of Electronic Materials. 32 [12] (2003) 1534-1539 10.1007/s11664-003-0126-y | |
| ODE, Machiko. Phase-Field Modeling for Sn-Bi Soldering. JOURNAL OF ELECTRONIC MATERIALS. (2003) 1534-1539 | |
| X. J. Liu, I. Ohnuma, C. P. Wang, M. Jiang, R. Kainuma, K. Ishida, M. Ode, T. Koyama, H. Onodera, T. Suzuki. Thermodynamic database on microsolders and copper-based alloy systems. Journal of Electronic Materials. 32 [11] (2003) 1265-1272 10.1007/s11664-003-0021-6 | |
| Shinichi Terashima, Yoshiharu Kariya, Takuya Hosoi, Masamoto Tanaka. Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects. Journal of Electronic Materials. 32 [12] (2003) 1527-1533 10.1007/s11664-003-0125-z | |
