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Impact of Electroplating at Lower Leveler Content on the Formation of Low Resistivity Narrow Cu Interconnects

Takashi Inami, Ryo Miyamoto, Kunihiro Tamahashi, Takashi Namekawa, Nobuhiro Ishikawa, Masahiko Ito, Jin Onuki.

NIMS author(s)


Fulltext and dataset(s) on Materials Data Repository (MDR)


    Created at: 2017-12-15 20:43:23 +0900Updated at: 2024-07-04 09:12:24 +0900

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