Impact of Electroplating at Lower Leveler Content on the Formation of Low Resistivity Narrow Cu Interconnects | SAMURAI, NIMS Researchers Directory Service

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Impact of Electroplating at Lower Leveler Content on the Formation of Low Resistivity Narrow Cu Interconnects

Takashi Inami, Ryo Miyamoto, Kunihiro Tamahashi, Takashi Namekawa, Nobuhiro Ishikawa, Masahiko Ito, Jin Onuki.

Journal of The Electrochemical Society 164 [7] D505-D510. 2017.

https://doi.org/10.1149/2.1531707jes

NIMS author(s)

ISHIKAWA, Nobuhiro

Fulltext and dataset(s) on Materials Data Repository (MDR)

Created at: 2017-12-15 20:43:23 +0900 Updated at: 2025-04-16 05:10:14 +0900

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