Hexagonal Boron Nitride for Nanoscale Heat Dissipation in Electronic and Photonic Chips

Bohai Liu; Riccardo Farina; Michał Świniarski; Wiktor Kwapiński; Ronny Omar De La Bastida Chiza; Marvin van Tilburg; Marvin Marco Jansen; Kenji Watanabe; Takashi Taniguchi; Erik P. A. M. Bakkers; Jos E. M. Haverkort; Klaas-Jan Tielrooij; Bohai Liu; Riccardo Farina; Michał Świniarski; Wiktor Kwapiński; Ronny Omar De La Bastida Chiza; Marvin van Tilburg; Marvin Marco Jansen; Kenji Watanabe; Takashi Taniguchi; Erik P. A. M. Bakkers; Jos E. M. Haverkort; Klaas-Jan Tielrooij

doi:10.1021/acs.nanolett.5c05376

Hexagonal Boron Nitride for Nanoscale Heat Dissipation in Electronic and Photonic Chips

Bohai Liu, Riccardo Farina, Michał Świniarski, Wiktor Kwapiński, Ronny Omar De La Bastida Chiza, Marvin van Tilburg, Marvin Marco Jansen, Kenji Watanabe, Takashi Taniguchi, Erik P. A. M. Bakkers, Jos E. M. Haverkort, Klaas-Jan Tielrooij.

Nano Letters 26 [7] 2415-2422. 2026.

https://doi.org/10.1021/acs.nanolett.5c05376

NIMS author(s)

Fulltext and dataset(s) on Materials Data Repository (MDR)

Created at: 2026-03-11 03:07:54 +0900 Updated at: 2026-09-18 04:32:04 +0900